• FLEXTURA 300 CLUSTER

    The most flexible 300mm platform


Flextura PVD cluster machine

FLEXTURA 300 CLUSTER

Introducing the Flextura 300 Cluster tool – building on the expertise gained from our Flextura 200 Cluster, this highly reliable PVD platform is an excellent choice for deposition of metals, oxides, and nitrides to produce high quality thin films.

Including degas, pre-clean, and PVD modules and utilising the flexibility of the Flextura platform, the Flextura 300 Cluster allows customer to optimise the configuration to best fit their applications.


STANDARD PROCESS MODULES

CLUSTER PLATFORM  HIGHLIGHTS

  • Atmospheric front-end with Brooks JCP EFEM and up to 4 FOUP load ports
  • Wafer mapping, wafer aligner, and cross-slot detection
  • Vision™ Leap industry standard load ports supporting up to 300mm FOUPs
  • Proven reliable wafer handling by Brooks Magnatron LEAP dual arm robot for maximum throughput and wafer placement repeatability
  • SECS/GEM compliant communication
  • GEM300 interface integration, Direct SQL server logging
  • Optional EDA/Interface A 
  • Substrate heating up to 950° C during deposition 
  • Room for up to six process modules 

PROCESS MODULES

Sputtering modules

  • Direct planar sputter module
  • Confocal sputtering
    • Multiple magnetrons
    • Multilayers in one module
    • Co-sputtering
  • Linear sputtering
    • Single or dual magnetrons
    • Planar or rotatable setup
  • DC, pDC, and RF magnetron sputtering
  • Reactive and nonreactive sputtering

Evaporation modules

  • E-beam evaporation module
  • Resistive evaporation module
  • Compatible with top-down as well as bottom-up processing

Degas, pre-clean and etch

  • Hot chuck degas or quartz lamp modules
  • RF etch module
  • ICP soft etch module

Is the Flextura 300 Cluster the correct PVD system for you?
Contact us for a technical and dedicated discussion regarding your needs,
or download our brochure on the Flextura 300 Cluster to read more!

Webbureau ITTP

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