EMI SHIELDING COATING

EMI (electromagnetic interference) is the problem: unwanted electromagnetic energy that disrupts the normal operation of electronic circuits. It can degrade signal integrity, cause data errors, or stop a device from functioning altogether.

EMC (electromagnetic compatibility) is the engineering goal: designing a product so it neither emits harmful interference nor is susceptible to it.

Achieving EMC compliance typically requires shielding, filtering, or a combination of both, and is mandatory for regulated markets such as medical, defence, and aerospace.

A thin, conductive metal layer – typically copper, silver, or a chromium/gold stack – is deposited directly onto the substrate surface using a magnetron sputtering PVD process. This creates a continuous conductive barrier that attenuates incoming and outgoing electromagnetic fields, reflecting or absorbing them before they reach sensitive electronics.

Because the coating is very thin, it adds negligible weight and allows complex geometries – including plastic enclosures – to be shielded without redesigning the part. The result is consistent, measurable shielding performance across high-volume production batches.