FLEXTURA 200 CLUSTER

The most flexible 200mm platform

FLEXTURA 200 CLUSTER

Flextura PVD cluster machine Polyteknik AS Transfer system with robot arm holding a wafer in a PVD cluster tool

FLEXTURA 200 CLUSTER

The Flextura 200 Cluster platform is probably the most flexible 200mm cluster tool available. It is truly almost Plug&Play and you may add process modules as your need for capacity or new processes increase.

Proven reliable wafer handling by Brooks MAG LEAP robot, cassette-to-cassette processing – SEMI standard cassette or custom cassette for even more flexibility.

The Flextura way of thinking is giving you the possibility to let the capital investment follow the increasing demands of your facility.

STANDARD PROCESS MODULES

CLUSTER PLATFORM HIGHLIGHTS

Process frame for epitaxial growth of thin films at elevated temperatures up to 1000°C
Glancing angle deposition on wafers in volume production
Dynamic in-situ feedback control by PEM or RGA in reactive sputtering
Electrostatic chuck (ESC) with backside gas for substrate cooling or heating, RF/DC bias option
P-chuck – pneumatic chuck with edge clamp
Remote Plasma Sputtering technology
SECS/GEM, Direct SQL server logging
Market leading process software technology for accurate real time control of deposition
Bridge tool – from R&D to 200mm wafers – standard SEMI or custom cassette

SPUTTERING MODULES

The Magnetron Sputtering modules of the Flextura PVD platform handles sputtering processes from well-known standard metallisation or electrode layers to reactive sputtering of highly c-axis oriented and low stress AlN, TCO’s or even ternary alloys.

Direct planar sputter module
Confocal sputtering
- Multiple magnetrons
- Multilayers in one module
- Co-sputtering
Linear sputtering
- Single or dual magnetrons
- Planar or rotatable setup
HiPIMS sputtering module
- High aspect ratio metallisation
- Layer property tuning
DC, pDC, and RF, Bipolar magnetron sputtering
Reactive and nonreactive sputtering

GLAD MODULE

The Flextura GLAD module is a production proven glancing angle evaporation module for industry scale volumes with fully automated substrate handling from cassette. Fully compatible with standard top-down processing ensuring fast and direct integration with complementary processes like degas, etch or sputtering.

Proven up to 200 mm diameter substrates
Rotation: 0-40 rpm, tilt: 0-180°, resolution 0.1°
GLAD stage with water cooling, ESC, or pneumatic chuck
Special ebeam crucible with 12x60cc pockets
Automatic pellet feeder option
Low base pressure <5E-8 mbar
SECS/GEM, MES direct SQL server logging

Proof of concept or contract R&D available for 100 mm!

DEGAS, PRE-CLEAN & ETCH

Substrate degas or pre-clean can be essential for your process or essential for your throughput.

Hot chuck degas or quartz lamp modules
RF Etch Module
ICP soft etch module

EVAPORATION MODULES

The Evaporation modules covers a range of evaporation processes and combinations of these including e-beam, thermal evaporation, resistive evaporation, as well as ion beam assisted deposition (IBAD).

Though not well known as a process in connection with a cluster tool, the Flextura evaporation modules can be connected to the Flextura Cluster platform for single substrate processing of advanced processes like high temperature epitaxial growth (still mainly R&D), or volume production of GLAD films – directly from cassette.

Compatible with top-down as well as bottom-up processing
CMOS compatible

Is the Flextura Cluster the correct PVD system for you?
Contact us for a technical and dedicated discussion regarding your needs,
or download our brochure on the Flextura Cluster to read more!

Brochure

Webbureau ITTP

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