FLEXTURA 300 CLUSTER

Introducing the Flextura 300 Cluster tool – building on the expertise gained from our Flextura 200 Cluster, this highly reliable PVD platform is an excellent choice for deposition of metals, oxides, and nitrides to produce high quality thin films.

Including degas, pre-clean, and PVD modules and utilising the flexibility of the Flextura platform, the Flextura 300 Cluster allows customer to optimise the configuration to best fit their applications.

STANDARD PROCESS MODULES

CLUSTER PLATFORM HIGHLIGHTS

Atmospheric front-end with Brooks JCP EFEM and up to 4 FOUP load ports
Wafer mapping, wafer aligner, and cross-slot detection
Vision™ Leap industry standard load ports supporting up to 300mm FOUPs
Proven reliable wafer handling by Brooks Magnatron LEAP dual arm robot for maximum throughput and wafer placement repeatability
SECS/GEM compliant communication
GEM300 interface integration, Direct SQL server logging
Optional EDA/Interface A
Substrate heating up to 950° C during deposition
Room for up to six process modules

PROCESS MODULES

Sputtering modules

Direct planar sputter module
Confocal sputtering
- Multiple magnetrons
- Multilayers in one module
- Co-sputtering
Linear sputtering
- Single or dual magnetrons
- Planar or rotatable setup
DC, pDC, and RF magnetron sputtering
Reactive and nonreactive sputtering

Evaporation modules

E-beam evaporation module
Resistive evaporation module
Compatible with top-down as well as bottom-up processing

Degas, pre-clean and etch

Hot chuck degas or quartz lamp modules
RF etch module
ICP soft etch module

Is the Flextura 300 Cluster the correct PVD system for you?
Contact us for a technical and dedicated discussion regarding your needs,
or download our brochure on the Flextura 300 Cluster to read more!

Contact us

Brochure

Webbureau ITTP