News

IPAC 2017, Copenhagen, Denmark, Date: 14-19 May 2017

Meet us at booth 28 & 29 at the 8th International Particle Accelerator Conference. This time held in Copenhagen from 14-19th of May. Learn more about: Our special coating systems for internal coating of tubes up to 3 meter in lenght. Custom designed high emissitivity coatings for vacuum cooling High resistivity coating with low secondary electron yield (SEY) Unique experince and costing systems for highly uniform internal coating of kicker chambers We look forward to present and dicuss our capabilities…

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Semicon Europe 2016, Grenoble, France, Date: 25-27 Oct 2016

Meet Polyteknik AS at Europes largest event for the Semicon Industry. The tradition continues and we are looking very much forward to meet new and existing customers and suppliers in Grenoble. We bring new process developments around high temperature deposition (substrate temperature up to 1000C) and experience on HiPIMS for high aspect ratio sputtering. Drop by booth 230, join Jens and Christian for a cup of coffee and lets discuss from there. Looking forward to see you! Free registration using…

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Newsletter – December 2015

In this edition, you will find a short review of the interesting days we had at Semicon Europe 2015 presenting our latest PVD system, the Infinity VB, which offers many advantages because of the vertical sputtering set-up. You will also be introduced to the new product in our range of components. Developed and patented by Polyteknik AS, our superior magnetron sources have been designed to offer a target change in less than 2 minutes in combination with superior target cooling.Thus…

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ROLL-OUT – Roll-to-roll sputtering process development

Polyteknik AS is participating in a brand new H2020 project known as ‘ROLL-OUT’, which is a partnership between various research institutes and private companies from Finland, Germany, Spain and Portugal. The project will focus on combining traditional roll-to-roll (R2R) compatible fabrication technologies such as printing with unique R2R sputtering, ALD and heterogeneous integration for flexible, thin, large-area electronics applications. The goal of the ROLL-OUT project is to create a multi-purpose technology for smart autonomous systems comprising of integrated circuits (based…

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