News

Did you know that our Flextura PVD platform was first launched in 2016. Developed with flexibility in mind – meaning today a number of standard process chambers are available and common to all, they can be operated as batch, single substrate or cassette-to-cassette loading. Today more than 15 Flextura units are placed at R&D and industry customers in Europe. With the Flextura platform we are able to bridge requirements from R&D as well as different scale-up stages with matching investment…

We are really looking forward to get out and meet with customers and business relations face-to-face again. Meanwhile we are always available for an online meeting – reach out to Christian Kjelde (ck@polyteknik.dk – +45 5183 8870) to plan detailed technical discussion on your specific thin film needs or just a general and mutual introduction as starting point. Talk to you rather sooner than later

Polyteknik AS will continue our service and production as usual, as timely precautions keeping our employees and customers safe have been implemented. We will closely monitor the development of the situation and comply with and support whatever guidelines are put in place by authorities to help prevent and contain the spread of the coronavirus. We are doing our utmost to protect our employees while also continuing to serve our customers. Our phone lines remain open, we are available for online meeting thus…

Meet us at following exhibitions during 2020 – Looking forward to seeing you there! Reach out in advance – sales@polyteknik.dk

Polyteknik AS introduces an advanced ebeam evaporation module for the Flextura PVD platform. The specific module is developed for production scale glancing angle deposition (GLAD) and is the first commercially available fully automated GLAD tool for cassette-to-cassette processing of 200mm wafers. The base transfer and loading module is the standard Flextura platform – meaning a cleanroom interface for standard cassette loading. Behind the cleanroom wall the “magic” takes place… It is a single wafer process module including an electrostatic chuck…

Polyteknik AS exhibits at the 3D & Systems Summit presenting our flexible PVD platform systems fitting Europes Semicon and electronics industry. Ask us and gain more than 25 years of experience with multilayer EMI coating on among other heat sensitive substrates – a solution for advanced packaging!